Descrizione
Technical Specifications
Model S100
Model D75
Printing Technology
Mask Image Projection
Stereolithography (SLA)
Digital Light Processing (DLP)
Hinged Peel Mechanism
Manual Resin Filling
Easily Removable Supports
Stereolithography (SLA)
Digital Light Processing (DLP)
Hinged Peel Mechanism
Manual Resin Filling
Easily Removable Supports
Print Volume
5 x 3.2 x 8 in
13 x 8 x 20 cm
13 x 8 x 20 cm
3.7 x 2.3 x 8 in
9.6 x 6 x 20 cm
9.6 x 6 x 20 cm
Layer Thickness Options
20 Microns, 50 Microns, 100 Microns
Minimum Feature Size
100 Microns
75 Microns
Print Speed
1 in/hour @ 100 Microns
0.5 in/hour @ 50 Microns
0.15 in/hour @ 20 Microns
0.5 in/hour @ 50 Microns
0.15 in/hour @ 20 Microns
Resin Curing Unit
SprintRay Custom-Built HD Projector
Million Pixels Density
Glass + Polycarbonate Lens Construction
Texas Instruments DLP Chip
405nm Blue-Violet Light
LED-based Light Source
50,000 Hours Expected Lifetime
Million Pixels Density
Glass + Polycarbonate Lens Construction
Texas Instruments DLP Chip
405nm Blue-Violet Light
LED-based Light Source
50,000 Hours Expected Lifetime
Resin Tank
Machined Aluminum Base Plate
Built-in Drain
Vacuum Formed Cover
Up to 50 Liters Extended Lifetime
One Spare Drum Included
Built-in Drain
Vacuum Formed Cover
Up to 50 Liters Extended Lifetime
One Spare Drum Included
Connectivity
Direct Ad-Hoc Mode via Wi-Fi b/g/n
Local Network via Wi-Fi b/g/n
Local Network via Ethernet Cable
Local Network via Wi-Fi b/g/n
Local Network via Ethernet Cable
Printer Control
Multi-functional Push Button with LED Status Indicator
Unit Dimensions
15 x 15 x 20 in
38 x 38 x 50 cm
38 x 38 x 50 cm
Shipping Size & Weight
22 x 22 x 34 in – 50 lb
56 x 56 x 86 cm – 23 kg
56 x 56 x 86 cm – 23 kg
